Grounding Bracket

This grounding bracket is so tiny, we use a vacuum system to remove it from the progressive die. It’s made from beryllium copper that is heat-treated and tin-plated. The part has to provide enough spring to ground a circuit to the enclosure. The customer tried outsourcing, but the Chinese manufacturer couldn’t produce the part to print.

Ajax produced the part to spec, and we use a Minnesota-based source for heat treating and plating. The result: The customer gets the desired quality and saves operating expense due to a streamlined supply chain.

Product Name: Grounding bracket
Project Scope: Material selection; strategic sourcing
Product Description: Grounding bracket for circuit board
Capabilities Applied/Processes: Progressive stamping
Tightest Tolerance: .004 inch +/-
Material Thickness: .010 inch
Material Used: C17200 BeCu
Material Finish: Heat-treated; tin-plated
Industry for Use: Electronics
Volume: 23K annually
Delivery Time: Kanban
Delivery Location: U.S.
Standards Met: Customer supplied print and 3D model
Product Name: Grounding bracket
Project Scope: Material selection; strategic sourcing