Grounding Bracket

This bracket is so tiny that we designed a vacuum system to remove it from the progressive die. It’s made from beryllium copper that is heat-treated and tin-plated. The part has to provide enough spring to ground a circuit to the enclosure. The customer tried outsourcing, but the Chinese manufacturer couldn’t produce the part to print.

Ajax produced the part to spec, and we use a Minnesota-based source for heat treating and plating. The result: the customer gets the desired quality and saves operating expenses due to a streamlined supply chain.

Grounding Bracket Specifications:

  • Product Name: Grounding bracket
  • Project Scope: Material selection; strategic sourcing
  • Product Description: Grounding bracket for circuit board
  • Capabilities Applied/Processes: Progressive stamping
  • Tightest Tolerance: .004 inch +/-
  • Material Thickness: .010 inch
  • Material Used: C17200 BeCu
  • Material Finish: Heat-treated; tin-plated
  • Industry for Use: Electronics
  • Volume: 23K annually
  • Delivery Time: Kanban
  • Delivery Location: U.S.
  • Standards Met: Customer supplied print and 3D model
  • Product Name: Grounding bracket
  • Project Scope: Material selection; strategic sourcing

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Ajax sales engineers are available to help you determine the most productive and cost-effective solution for your metal forming project.