Tiny Progressive-Stamped Beryllium Copper Grounding Bracket

This bracket is so tiny that we designed a vacuum system to remove it from the progressive die. It’s made from beryllium copper that is heat-treated and tin-plated. The part has to provide enough spring to ground a circuit to the enclosure. The customer tried outsourcing, but the Chinese manufacturer couldn’t produce the part to print.

Ajax produced the part to spec, and we use a Minnesota-based source for heat treating and plating. The result: the customer gets the desired quality and saves operating expenses due to a streamlined supply chain.

Specifications:

• Product Name: Grounding bracket
• Project Scope: Material selection; strategic sourcing
• Product Description: Grounding bracket for circuit board
• Capabilities Applied/Processes: Progressive stamping
• Tightest Tolerance: .004 inch +/-
• Material Thickness: .010 inch
• Material Used: C17200 BeCu
• Material Finish: Heat-treated; tin-plated
• Industry for Use: Electronics
• Volume: 23K annually
• Delivery Time: Kanban
• Delivery Location: U.S.
• Standards Met: Customer supplied print and 3D model
• Product Name: Grounding bracket
• Project Scope: Material selection; strategic sourcing